Shenzhen Comofaje SMD Stencil Clean Roll need how to use

The basic process of SMT Stencill Clean Roll:

1. The function of mounting is to accurately install the exterior component to the fixed position.

2. Screen printing is used to print the welded or patch adhesive onto the pcb pad to prepare for the welding of components.

3. The glue is to drop the glue to the fixed position of the pcb, its main role is to fix the components to the pcb board.

4. The function of reflow welding is to melt the welding and make the external assembled components and pcb board firmly bonded together. The equipment used is reflow welding furnace, located behind the smt machine in the steel mesh production line.

5. The role of curing is to melt the patch glue, so that the external assembled components and pcb board are bonded together.

6. The function of inspection is to check the welding quality and installation quality of assembled pcb board. According to the inspection requirements, can be equipped in the production line suitable local.

7. The cleaning function is to remove harmful welding residues such as flux on the assembled pcb board.

8. The function of repair is to rework the defective pcb board. Good stencil clean roll should be used in a clean environment to open the internal bag, the bag should be clean before unpacking, the opening must be kept clean dust-free wipe clean.